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Applicationï¼DDR5.jpg

2 Layers.jpg

High Precision Product Display

Material：BT Material
Surface Finish： ENEPIG
Package Type：LGA

Materialï¼BT_Material.jpg

4 Layers Cavity Down in Inner Layer PCB.

4 Layers Cavity Down in Inner Layer PCB
Surface Finish： Soft Gold
Bonding PAD Size：100um
Package Type：BGA

Material：BT Material
Line Width & Space：50um/50um
Surface Finish： ENEPIG
Package Type：BGA
Application：Environmental monitoring sensor

BT Material.jpg

8 Layers 2+4+2 Stack-up.jpg

8 Layers 2+4+2 Stack-up
Flip Chip PAD Size：90um
Line Width & Space：40um/40um
Surface Finish： ENEPIG
Package Type：Flip Chip

Line Width & Space：35um/35um
Stack-up：Embedded Capacitance & Resistance & Cavity
Surface Finish：Soft Thick Gold & Immersion Thick Gold
Package Type：MEMS

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